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    2. 各種電路板支架之比較

      此圖示各個電路板的比較表,

      我們的製程是用DPC薄膜製程,可用於高功率

      穩定性很高~可讓你的產品散熱效果好,壽命很長

       
      FR-4 PCB
      Metal Core PCB (MCPCB)
      LTCC Ceramic Substrate
      Thick-Film Ceramic substrate
      DPC/Thin-Film Ceramic Substrate (Al2O3)
      DPC/Thin-Film Ceramic Substrate (AlN)
      Thermal conductivity
      0.3~0.4 W/mK
      0.7~3 W/mK
      2~5 W/ mK
      15~20 W/mK
      20~27 W/ mK
      170~190 W/mK
      Resolution
      50 μm
      50 μm
      150 μm
      150 μm
      10 μm
      10 μm
      Graduated Difference
      <10 μm
      <10 μm
      > +/- 200 μm
      > +/- 200 μm
      <10 μm
      <10 μm
      Applications
      Suitable for low power applications (<0.5W)
      Suitable for middle power applications (<1W)
      Suitable for middle power applications (<1W)
      Suitable for middle power applications (<1 W)
      Suitable for high power applications (1~3W)
      Suitable for high power applications (1~10W)
      Cost
      Low
      Middle
      Middle-high
      Middle
      Middle-high
      Higher
      Wire bonding available
      Yes
      Yes
      Yes
      Yes
      Yes
      Yes
      Eutetic bonding available
      N/A
      N/A
      No
      Poor
      Yes
      Yes
      Flip chip bonding available
      N/A
      N/A
      No
      Poor
      Yes
      Yes

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