各種電路板支架之比較
此圖示各個電路板的比較表,
我們的製程是用DPC薄膜製程,可用於高功率
穩定性很高~可讓你的產品散熱效果好,壽命很長
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FR-4 PCB
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Metal Core PCB (MCPCB)
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LTCC Ceramic Substrate
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Thick-Film Ceramic substrate
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DPC/Thin-Film Ceramic Substrate (Al2O3)
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DPC/Thin-Film Ceramic Substrate (AlN)
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Thermal conductivity
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0.3~0.4 W/mK
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0.7~3 W/mK
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2~5 W/ mK
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15~20 W/mK
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20~27 W/ mK
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170~190 W/mK
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Resolution
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50 μm
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50 μm
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150 μm
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150 μm
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10 μm
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10 μm
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Graduated Difference
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<10 μm
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<10 μm
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> +/- 200 μm
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> +/- 200 μm
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<10 μm
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<10 μm
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Applications
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Suitable for low power applications (<0.5W)
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Suitable for middle power applications (<1W)
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Suitable for middle power applications (<1W)
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Suitable for middle power applications (<1 W)
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Suitable for high power applications (1~3W)
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Suitable for high power applications (1~10W)
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Cost
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Low
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Middle
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Middle-high
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Middle
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Middle-high
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Higher
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Wire bonding available
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Yes
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Yes
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Yes
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Yes
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Yes
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Yes
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Eutetic bonding available
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N/A
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N/A
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No
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Poor
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Yes
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Yes
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Flip chip bonding available
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N/A
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N/A
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No
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Poor
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Yes
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Yes
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